Disk Centrifugal Plating
1. Application
- Highprecision, small, sheet, needle, through hole, floating, highrequirement for thickness uniformity, unable to plate using traditional horizontal barrel
method; Disk centrifuge plating barrel is best suit for above applications.
- Highprecision, small, sheet, needle, through hole, floating, highrequirement for thickness uniformity, unable to plate using traditional horizontal barrel
2. Disk Type Plating Machine
Multinational invention patents, excellent application with precisely small parts, outstanding plating distribution, continuous plating, high output.
- Modularized design concept, quick assembly within a week, easy relocation, significantly reduces assemble time and construction.
- Overhead hoist or robotic arm design to improve industrial safety performance.
- Provide main tank utility, consistent plating solution concentration, easy for maintenance and cleaning, and rapid recovery operation.
- Batch drainage after rinse, reduces water usage.
- Intelligence production managing system, flexible production, mass production with consideration of small production diversification.
Hoist Type
Robot Arm Type
3. Disk Type Rack and Barrel
Multinational invention patent, appliedin extremely small parts, the following explains its coretechnology.
- Plating solution is forced convection, increase solution exchange rate, do not need any conductive media.
- Interchangeable barrel, Shared platinghanger, High uniform film thickness, high productivity.
- Does not need conductive media, saving on anode, reduce plating solution, reduce working procedure.
- Excellent tightness, no risk of product spill or stuck.
- Can configured with RFID to implement intelligent production and maintenance management.
- No material floats issue, increase efficient consistent plating.
Plating Rack
Barrel 1、2、3、4L
4. Effects and Features
- Semi conductive parts or parts requires conductive medium: micro precision, passive component, connectors, testing probes, precise non conductive component.
- Capabilities: Highly uniform thickness, excellent coverage, smoother, lower twinning, water saving, power saving, cathode saving, reduce wastewater, approximate 50% saving operations cost.
- Conductive parts or parts do not requires conductive medium: connectors, test probes, conductive metals
Capabilities: Highly uniform thickness, excellent coverage, smoother.
Semi conductive
Conductive
5. Technical Services
- Globally pioneered equipment, international patent invention, Hallmark proudly to share and explore together in terms of hardware, software, parameter with our business partners.
6. Tsinghua University(NTHU) Analysis Report
- Department：TsingHua University Material Department Duh Jeng-Gong Laboratory
- Sample：MLCC Capacitance
- Complete Date：March 09, 2020
Ni Disk Plating Sn
Ni Conventional Plating Sn
Analysis Scope: Top and Corner
Quality: Excellent coverage, Smoother, Uniform Thickness
Disk Plating
Conventional Plating
7. Existing customers
